Book chapters

Guest editor of a special issue for the journal, Thin Solid Films, “Mechanical Behavior of Thin Films and Small Structures”, Ed. X. Zhang et al, 2005.

 

PATENTS

1. “High-strength twinned Nanolayer Structure”, US patent, Xinghang Zhang, Amit Misra, Michael A. Nastasi and Richard G. Hoagland, US Patent, 2006.

2. “A Method for Preparing Bulk Amorphous and Nanocrystalline Alloy.” Fei Zhou, Xinghang Zhang, Faqiang Guo, Yijiong Du and Ke Lu, Paten No: ZL97101247.4., Classified No. of International Patent: C22C 1/00

3. “A Kind of New Equipment for Measuring Electrical Resistance of Phase Transition from High Temperature to Low Temperature.” Ke Lu, Qiong Wang, Fengjun Tang, Fei Zhou and Xinghang Zhang, 98114107.2.

4. “A High Precision Method for Measuring Electrical Resistance of Phase Transition from High Temperature to Low Temperature.” K. Lu, Q. Wang, F. Tang, F. Zhou and X. Zhang, 98114108.0.

 

PUBLICATIONS

39 articles in referred international journals, 2 review articles, 22 conference proceedings, 14 oral presentations and 3 invited talks.

 

I. Journal articles (34 published or accepted, 6 submitted, 5 in preparation)

1.      X. Zhang, A. Misra, H. Wang, X. H. Chen, L. Lu, K. Lu, and R. G. Hoagland, “High-strength Sputter-deposited Cu Foils with Preferred Orientation of Nanoscale Growth Twins”, APPLIED PHYSICS LETTERS 88 (2006) 173116.

2.      N. A. Mara, A. V. Sergueeva, T. Tamayo, X. Zhang, A. Misra and A. Mukherjee, “High Temperature Mechanical Properties of Cu/Nb Nanoscale Multilayers at Diminishing Length Scales”, Thin Solid Films, acecpted.

3.      T. D. Shen, X. Zhang, R. Schwarz, “High-Strength Cu-Ag Nanocomposites Synthesized via Flux Melting Technique”, Applied Physics Letters, accepted.

4.      X. Zhang, A. Misra, H. Wang, J. G. Swadener, A. L. Lima, M. F. Hundley, and R. G. Hoagland, “Thermal stability of sputter-deposited 330 austenitic stainless-steel thin films with nanoscale growth twins”, Applied Physics Letters, 87 (2005) 233116.  

5.      X. Zhang, A. Misra, H. Wang, A. L. Lima, M. F. Hundley, R. G. Hoagland, “Effects of Deposition Parameters on Residual Stresses, Hardness and Electrical Resistivity of Nanoscale Twinned 330 Stainless Steel Thin Films”, Journal of Applied Physics, 97 (2005) 094302.

6.      A. Misra, X. Zhang, D. Hammon, R.G. Hoagland, “Work hardening in rolled nanolayered metallic composites”, Acta Materialia, 53 (2005) 221.

7.      Lin Shao,Y. Q. Wang, X. Zhang, C. J. Wetteland, P. E. Thompson, J. W. Mayer and M. Nastasi, “Optimized energy window of He beams for accurate determination of depth in channeling Rutherford backscattering spectrometry”, Applied Physics Letters, 86 (2005) 221913.

8.      L. G. Jacobsohn, X. Zhang, A. Misra and M. Nastasi, “Synthesis of metallic nanocrystals with size and depth control: A case study”, Journal of Vacuum Science and Technology, B 23 (2005) 1470.

9.      S. Park, X. Zhang, A. Misra, J. D. Thompson, S. Lee , C. M. Falco and M. R. Fitzsimmons, “Tunable magnetic anisotropy of ultrathin Co layers”, Applied Physics Letters, 86 (2005) 042504.

10. S. Roy, M. R. Fitzsimmons, S. Park, M. Dorn, O. Petracic, Igor V. Roshchin, Zhi-Pan Li, X. Batlle, R. Morales, A. Misra, X. Zhang, K. Chesnel, J. B. Kortright, S. K. Sinha, and Ivan K. Schuller, “Depth Profile of Uncompensated Spins in an Exchange Bias System”, Physical Review Letters, 95 (2005) 047201.

11. Wang, H; Liao, XZ; Xu, HF; Zhang, X; Lin, Y; Foltyn, SR; Arendt, PN; MacManus-Driscoll, JL; Zhu, YT; Jia, QX, “Effects of Eu interfacial mobility on the growth of epitaxial EuBa2Cu3O7-d films”, Applied Physics Letters; 86 (2005)101912.

12. X. Zhang and A. Misra, “Residual Stresses in Sputter Deposited Copper / 330 Stainless Steel Multilayers”, Journal of Applied Physics, 96 (2004) 7173.

13. X. Zhang, A. Misra, H. Wang, T. E. Mitchell, M. Nastasi, J. P. Hirth, J. D. Embury and R. G. Hoagland, “Enhanced Hardening in Cu/330 Stainless Steel Multilayers by Nanoscale Twinning”, Acta Materialia, 52 (2004) 995.

14. X. Zhang, A. Misra, H. Wang, M. Nastasi, J. D. Embury, T. E. Mitchell, R. G. Hoagland and J. P. Hirth, “Nanoscale Twinning Induced Strengthening in Austenitic Stainless Steel”, Applied Physics Letter, 84 (2004) 1096.

15. X. Zhang, M. Hundley, A. Misra, H. Wang, M. Nastasi, J. P. Hirth, J. D. Embury and R. G. Hoagland, “Microstructure and Electrical Properties of Nanostructured Cu/Mo Multilayers”, Journal of Applied Physics, 95 (2004) 3644.

16. X. Zhang, A. Misra, C. J. Wetteland, H. Kung, J. D. Embury, M. Nastasi, H. Wang, “Critical Factors that Determine Face-centered Cubic to Bod-centered CubicPhase Transformations in Sputter-deposited Austenitic Stainless Steel Films ”, Journal of Materials Research, 19 (2004) 1696.

17. H. Wang, S. R. Foltyn, P. N. Arendt, Q. X. Jia, J. L. MacManus-Driscoll, X. Zhang and P. C. Dowden, “Microstructure of SrTiO3 buffer layers and its effects on superconducting properties of YBa2Cu3O7-δ coated conductors”, Journal of Materials Research, 19, 1869 (2004).

18. Wang, H; Zhang, X; Hundley, MF; Thompson, JD; Gibbons, BJ; Lin, Y; Arendt, PN; Foltyn, SR; Jia, QX; MacManus-Driscoll, JL, “Effect of crystallinity on the transport properties of Nd0.67Sr0.33MnO3 thin films”, Applied Physics Letters; 16 (2004) 1147.

19. C. M. Lepienski, G. M. Pharr, Y. J. Park, T. R. Watkins, A. Misra and X. Zhang, “Factors Limiting the Measurement of Residual Stresses in Thin Films by Nanoindentation”, Thin Solid Films, 447 (2004) 251.

20. H. Wang, A. Gupta, Ashutosh Tiwari, X. Zhang, and J. Narayan, “TaN-TiN binary alloys and superlattices as diffusion barriers for copper interconnections”, Journal of Electronic Materials, 33 (2004) L5.

21. A. Misra, X. Zhang, D. Hammon and R.G. Hoagland, “Work Hardening in Rolled Nanolayered Metallic Composites”, Acta Materialia, 53 (2005) 221.

22. H. Wang, Ashutosh Tiwari, A. Gupta, X. Zhang, and J. Narayan, “TaN-TiN Binary-Component Thin Films as Diffusion Barriers for Copper Interconnects”, Journal of Electronic Materials, 32 (2003) 994.

23. H. Wang, A. Gupta, Ashutosh Tiwari, X. Zhang, and J. Narayan, “Growth and Characteristics of TaN/TiN Superlattice Structures”, Applied Physics Letter, 83 (2003) 3072.

24. X. Zhang, A. Misra, H. Kung, T. D. Shen, J. G. Swadener, J. D. Embury, M. Nastasi, H. Wang, “Microstructure and Mechanical Properties of Nanostructured Copper-304 Stainless Steel Multilayers by Magnetron Sputtering”, Journal of Materials Research, 18 (2003) 1600.

25. X. K. Zhu, X. Zhang, H. Wang, R. O. Scattergood, J. Narayan and C. C. Koch. “Synthesis of High Tensile Ductility Bulk Nanostructured Zn by Combinations of Cryomilling and Room Temperature in situ Consolidation”, Scripta Materialia, 49 (2003) 429.

26. X. Zhang, H. Wang, M. Kassem, R. O. Scattergood, J. Narayan and C. C. Koch, “Evolution of Microstructure and Mechanical Properties of In Situ Consolidated Bulk Ultra-fine-grained and Nanocrystalline Zn Prepared by Ball Milling”, Materials Science and Engineering A, 344 (2003) 175.

27. X. Zhang, H. Wang, R. O. Scattergood, J. Narayan and C. C. Koch, “Modulated Oscillatory Hardening and Dynamic Recrystallization in Cryomilled Nanocrystalline Zn”, Acta Materialia, 50 (2002) 3995-4004.

28. X. Zhang, H. Wang, R. O. Scattergood, J. Narayan and C. C. Koch, “Mechanical Properties of Cryomilled Nanocrystalline Zn Studied by the Miniaturized Disk Bend Test”, Acta Materialia, 50 (2002) 3527-3533.

29. X. Zhang, H. Wang, M. Kassem, J. Narayan and C. C. Koch, “Preparation of Bulk Ultrafine-grained and Nanostructured Zn, Al and Their Alloys by Insitu Consolidation of Powders during Mechanical Attrition”, Script Materialia, 46 (2002) 661-665.

30. X. Zhang, H. Wang, R. O. Scattergood, J. Narayan and C. C. Koch, “Studies of Deformation Mechanisms in Ultra-fine-grained and Nanostructured Zn”, Acta Materialia, 50 (2002) 4823.

31. X. Zhang, H. Wang, R. O. Scattergood, J. Narayan, A. Sergueeva, A. Mukherjee and C. C. Koch, “Tensile Elongation (110%) Observed in Ultra-fine-grained Zn at Room Temperature”, Applied Physics Letter, 81 (2002) 823.

32. H. Wang, A. Tiwari, A. Kvit, X. Zhang and J. Narayan, “Epitaxial Growth of TaN Thin Films on Si (100) and Si (111) Using a TiN Buffer Layer”, Applied Physics Letter, 80 (2002) 2323-2325.

33. H. Wang, A. Tiwari, X. Zhang, A. Kvit and J. Narayan, “Copper Diffusion Characteristics in Single-Crystal and Polycrystalline TaN”, Applied Physics Letter, 81 (2002) 1453-1455.

34. X. Zhang, H. Wang, J. Narayan and C. C. Koch, “Evidence for the Formation Mechanism of Nanoscale Microstructures in Cryomilled Zn Powder”, Acta Materialia, 49 (2001) 1319-1326.

35. X. Zhang, H. Wang, M. Kassem, J. Narayan and C. C. Koch, “Origins of Stored Enthalpy in Cryomilled Nanocrystalline Zn”, Journal of Materials Research, 16 (2001) 3485-3495.

36. H. Wang, A. Sharma, A. Kvit, X. Zhang, C. C. Koch, Q. Wei and J. Narayan, “Mechanical Properties of Nanocrystalline and Epitaxial TiN Films on (100) Si”, Journal of Materials Research, 16 (2001) 2733-2738.

37. K. Lu and X. H. Zhang, “Identification of Crystal Nucleation and Growth in an Amorphous FeZr2 Alloy by Means of Electrical Resistance Measurements”, Philosophical Magazine Letter, 80 (2000) 797. 

38. F. Zhou, X. H. Zhang and K. Lu, “Synthesis of a Bulk Amorphous Alloy by Consolidation of the Melt-spun Amorphous Ribbons Under High Pressure”, Journal of Materials Research, 13 (1998) 784.

39. N. X. Sun, K. Zhang, X. H. Zhang, X. D. Liu and K. Lu, “Nanocrystallization of amorphous Fe33Zr67 alloy”, Nanostructured Materials, 7 (1996) 637.

40. X. Zhang, J. G. Swadener, T. Höchbauer,A. Misra and R. G. Hoagland, Radiation Tolerant Nanostructured Cu/Nb Multilayers Under He Ion Irradiation”, submitted.

41. X. Zhang, R. Schulze, C. J. Wetteland and A. Misra, “Thermal Stability of Cu/304 Stainless Steel Multilayer Films”,  in preparation.

42. O. Anderoglu, A. Misra, R. G. Hoagland, and X. Zhang, “Thermal Stability of Cu Films with Nanoscale Growth Twins”, in preparation.

43. N. Li, A. Misra, R. G. Hoagland, and X. Zhang, “Mechanical Properties of Cu/Ni Multilayer Films”, in preparation.

44. EG. Fu, N. Li, A. Misra, R. G. Hoagland, and X. Zhang, “Comparison of Interface Induced Strengthening in Cu/V, Cu/Nb and Al/Nb Multilayer Films”, in preparation.

45.  O. Anderoglu, A. Misra, R. G. Hoagland, and X. Zhang, “Influence of Deposition Rate on the Formation of Nanoscale Growth Twins in Sputtered 330 Stainless Steel Thin Films”, in preparation.

 

II. Invited review article

46. X. Zhang, H. Wang and C. C. Koch, “Mechanical Behavior of Bulk Nanocrystalline Zn”, Reviews on Advanced Materials Science, 6 (2004) 53.

 

47. X. Zhang, A. Misra and R. G. Hoagland, “Interface induced strengthening in nanolayered Cu/stainless steel thin films”, Advanced Engineering Materials, in preparation.

 

III. Conference proceedings (22)

1. X. Zhang and C.C. Koch, “Processing, Characterization, and Properties of Nanocrystalline Zinc”, in Ultrafine Grained Materials, TMS Annual Meeting in Nashville, Tennessee, Mar., 2000.

 

2. X. Zhang, H. Wang, R. O. Scattergood, J. Narayan and C. C. Koch, “Cyclic Microhardness Behavior Observed in Cryomilled Nanocrystalline Zn”, MRS Proceeding, Fall 2001.

 

3. H. Wang, A. Kvit, X. Zhang, C.C. Koch, and J. Narayan, “Mechanical and Electrical Properties of Nanocrystalline and Single Crystalline TiN”, Mater. Res. Soc. Symp. Proc., v697, 279 (2003).

 

4. X. Zhang; A. Misra; H. Wang; H. Kung; J. D. Embury; R. G. Hoagland; M. Nastasi, “Microstructures and mechanical properties of nanostructured copper-304 stainless steel multilayers synthesized by magnetron sputtering”, Mater. Res. Soc. Symp. Proc.v.740, p.49-54 (2003)

 

5. H. Wang, Ashutosh Tiwari, X. Zhang, A. Kvit, and J. Narayan, “Copper Diffusion Characteristics in Single Crystal and Polycrystalline TaN”, Mater. Res. Soc. Symp. Proc., v745, 265(2003).

 

6. H. Wang, A. Tiwari, A. Gupta, X. Zhang, and J. Narayan, “Growth of TiN/AlN Superlattice by Pulsed Laser Deposition”. MRS Fall meeting, 2002. 

 

7. X. Zhang, A. Misra, H. Wang, H. Kung, J. D. Embury, M. Nastasi, “Microstructures and Mechanical Properties of Nanoscale Copper-304 Stainless Steel Multilayers Synthesized by Magnetron Sputtering”, TMS Spring meeting, 2003.

 

8. H. Wang, A. Gupta, Ashutosh Tiwari, X. Zhang, and J. Narayan, “Growth of TiN/AlN Superlattice by Pulsed Laser Deposition”, Surface Engineering: in Materials Science II, 219 (2003), TMS proceeding.

 

9. H. Wang, A. Gupta, Ashutosh Tiwari, X. Zhang, and J. Narayan, “TaN-TiN Binary-Component Thin Films as Diffusion Barriers for Copper Interconnects”, TMS Meeting, Spring 2003.

 

10. X. Zhang, A. Misra, H. Wang, M. Nastasi, T. E. Mitchell, J. D. Embury, R. G. Hoagland and J. P. Hirth, “Nanoscale Twinning Induced Strengthening in 330 Austenitic Stainless Steel”, TMS Fall meeting, 2003.

 

11. H. Wang, A. Tiwari, A. Kvit, X. Zhang and J. Narayan, “Single Crystal TaN Thin Films on TiN/Si Heterostructure”, Mater. Res. Soc. Symp. Proc.,v745, 265(2003).

 

12. X. Zhang, A. Misra, H. Wang, M. Nastasi, J. D. Embury, T. E. Mitchell, R. G. Hoagland and J. P. Hirth, “Strengthening Induced by Nanoscale Twinning in Cu/330 Stainless Steel Multilayers and Single Layer 330 Stainless Steel Thin Films”, MRS Fall meeting, 2003.

 

13. X. Zhang, A. Misra, H. Wang, M. Nastasi, J. D. Embury, T. E. Mitchell, R. G. Hoagland and J. P. Hirth, “Residual Stresses in Sputter Deposited Austenitic 330 stainless Steel Thin Films and Copper/330 Stainless Steel Multilayers”, MRS Fall meeting, 2003.

 

14. H. Wang, S. R. Foltyn, P. N. Arendt, Q. X. Jia, J. L. MacManus-Driscoll, X. Zhang and P. C. Dowden, “Microstructure of SrTiO3 buffer layers and its effects on superconducting properties of YBa2Cu3O7-δ coated conductors”, MRS Fall meeting, 2003.

 

15. S. Park, X. Zhang, A. Misra, M. R. Fitzsimmons, J. D. Thompson, M. F. Hundley, M. Nastasi, J. Shaw and C. M. Foco, “Correlation Between Magnetic and Structural Properties of Nanostructured Co Films”, MRS Fall meeting, 2003.

 

16. M. Hundley, A. Misra, E. Bauer, C. Booth, A. Malinowaki, X. Zhang and M. Nastasi, “Anomalous Electronic Transport Properties in Nanoscale Cu-Nb Bilayer Films”, to be presented on MRS Fall meeting, 2003.

 

17. J. G. Swadener, M. I. Baskes, T. E. Felter, C. J. Wetteland, J. R. Tesmer, X. Zhang and M. Nastasi, “Optimizing the Fracture Toughness of Brittle Materials by Ion Implantation”, to be presented on MRS Fall meeting, 2003.

 

18. A. Misra, R. G. Hoagland, D. L. Hammon, X. Zhang, J. D. Embury and J. P. Hirth, “Work Hardening and Fracture in Room Temperature Rolled Nanoscale Cu-Nb Multilayers”, to be presented on MRS Fall meeting, 2003.

 

19. X. Zhang, A. Misra, H. Wang, C. J. Wetteland, R. K. Schulze, J. D. Embury, M. Nastasi and R. G. Hoagland, “Critical Factors That Determine FCC to BCC Phase Transformation in Sputter Deposited Austenitic Stainless Steel Films”, 2004 TMS Annual meeting, March, Charlotte, NC.

 

20. A. Misra, X. Zhang, M. Nastasi and R. G. Hoagland, “The Effect of Length Scale on the Plastic Stability of Nanolayered Metals”, 2004 TMS Annual meeting, March, Charlotte, NC.

 

21. S. Park, X. Zhang, A. Misra, J. Thompson, M.R. Fitzsimmons, M. Nastasi, C.M. Falco, “Magnetic and structural properties of ultra-thin Co films”, will be presented at MML 2004 Conference (Boulder, CO, June 7 - 10, 2004).

 

22. M.F. Hundley, A. Lima, A. Misra, X. Zhang, E.D. Bauer, and C. Booth, “Nanoscale Structure and Electronic Transport Correlations in Cu-Nb Bilayers”, MRS 2004 Spring meeting (San Francisco, CA, April 12-16, 2004).

 

IV. Invited talks

1. “Interface Induced Strengthening in Nanolayered Materials”, Institute of Metal Research, Chinese Academy of Sciences, 2004.

2. “Strengthening Mechanisms in Nanostructured Layered Materials”, in the symposium of “Frontiers in Thin Film Growth and Nanostructured Materials: A Symposium in Honor of Professor Jagdish Narayan” 2005 TMS annual meeting, San Francisco, CA.

3. “Nanostructured Metallic Materials with Advanced Radiation Tolerance.”, CAARI, Dallas, TX, Aug. 2006.

 

V. Oral presentations at professional conference or workshop (14 total)

1. X. Zhang, H. Wang, R. O. Scattergood, J. Narayan and C. C. Koch, “Cyclic Microhardness Behavior Observed in Cryomilled Nanocrystalline Zn”, MRS Proceeding, Fall 2001.

 

2. X. Zhang, R. Scattergood, J. Narayan and C.C. Koch, “Mechanical Properties of Nanostructured Zn”, Nanoscience and Technology Workshop 2002, Georgia Institute of Technology, Atlanta.

 

3. X. Zhang, A. Misra, H. Wang, H. Kung, J. D. Embury, J. P. Hirth, Microstructure and Mechanical Properties of Cu-304 Stainless Steel Multilayers”, MRS Fall meeting, 2002.

 

4. X. Zhang, A. Misra, H. Kung, J. D. Embury and M. Nastasi, “Microstructures and Mechanical Properties of Nanoscale Copper-304 Stainless Steel Multilayers Synthesized by Magnetron Sputtering”, The Fourteenth Annual Rio Grande Regional Symposium on Advanced Materials, Albuquerque, 2002.

 

5. X. Zhang, A. Misra, H. Wang, H. Kung, J. D. Embury, M. Nastasi, “Microstructures and Mechanical Properties of Nanoscale Copper-304 Stainless Steel Multilayers Synthesized by Magnetron Sputtering”, TMS Spring meeting, 2003.

 

6. X. Zhang, A. Misra, H. Wang, M. Nastasi, T. E. Mitchell, J. D. Embury, R. G. Hoagland and J. P. Hirth, “Nanoscale Twinning Induced Strengthening in 330 Austenitic Stainless Steel”, to be presented in TMS Fall meeting, 2003.

 

7. X. Zhang, A. Misra, H. Wang, M. Nastasi, J. D. Embury, T. E. Mitchell, R. G. Hoagland and J. P. Hirth, “Strengthening Induced by Nanoscale Twinning in Cu/330 Stainless Steel Multilayers and Single Layer 330 Stainless Steel Thin Films”, to be presented on MRS Fall meeting, 2003.

 

8. X. Zhang, A. Misra, H. Wang, M. Nastasi, J. D. Embury, T. E. Mitchell, R. G. Hoagland and J. P. Hirth, “Residual Stresses in Sputter Deposited Austenitic 330 stainless Steel Thin Films and Copper/330 Stainless Steel Multilayers”, to be presented on MRS Fall meeting, 2003.

 

9. X. Zhang, A. Misra, H. Wang, C. J. Wetteland, R. K. Schulze, J. D. Embury, M. Nastasi and R. G. Hoagland, “Critical Factors That Determine FCC to BCC Phase Transformation in Sputter Deposited Austenitic Stainless Steel Films”, 2004 TMS Annual meeting, March, Charlotte, NC.

 

10. X. Zhang, A. Misra, H. Wang, M. Nastasi and R. G. Hoagland, “Synthesis and Characterization of Nanoscale Twins in Sputtered 330 Stainless Steel Thin Films”, The Sixteenth Annual Rio Grande Symposium on Advanced Materials, Albuquerque, NM, Oct. 2004.

 

11. X. Zhang, A. Misra and R. G. Hoagland, “Stability of Nanoscale Twins in Sputtered 330 Stainless Steel Thin Films”, MRS fall meeting, 2004.

 

12. X. Zhang, A. Misra, H. Wang, M. Nastasi and R. G. Hoagland, “Stability of Nanoscale Twins in Sputtered 330 Stainless Steel Thin Films”, 2005 TMS annual meeting, San Francisco, CA.

 

13. X. Zhang, A. Misra, H. Wang, M. Nastasi and R. G. Hoagland, “Influence of Deposition Rate on the Formation of Nanoscale Growth Twins in Sputtered 330 Stainless Steel Thin Films”, 2006 TMS annual meeting, San Antonio, TX.

 

14. X. Zhang, A. Misra, H. Wang, M. Nastasi and R. G. Hoagland, “High Strength Sputter-deposited Cu Foils with Nanoscale Growth Twins”, 2006 MRS Spring meeting, San Francisco, CA.